To investigate the thermal stability of the silver nanoparticles, the mass decrease was recorded byTGA (Figure 1). The TGA curve shows a decrease of 32.23 wt% at an initial step from 30 to 200 °C, which correspondsto the boiling temperature of eth-ylene glycol. Asingle deflection point and gradual de- creasesfrom 300 to 600 °Cindicate the capping agent is removed. Finally, the residual massis 63.88 wt% that isthe nanosilver containing in the conductive ink. To lower down the sintering temperature and mini- mize the sintering time of the silver paste with maintaining a good conductivity, the silver paste should be producedwithoutleavinga highlycontent ofresin such as polymer binders. It can be seen the ratio of PVP to silver is 0.048 which can show good conductivity. Furthermore, there are no toxic dispersion solvent and other resin containing in our conductive ink, and it is environmentalfriendly formoving forwardsto industrial production.
Characterization of silver nanopaste
- Jul 25, 2017-